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ISBN10: 0071418075 | ISBN13: 9780071418072
ISBN10: 0071418075
ISBN13: 9780071418072
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LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Chapter 1: Introduction to Microsystems Packaging. Chapter 2: The Role of Packaging in Microelectronics Chapter 3: The Role of Packaging in Microsystems. Chapter 4: Fundamentals of Electrical Package Design. Chapter 5: Fundamentals of Design for Reliability. Chapter 6: Fundamentals of Thermal Management. Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 3: The Role of Packaging in Microsystems. Chapter 4: Fundamentals of Electrical Package Design. Chapter 5: Fundamentals of Design for Reliability. Chapter 6: Fundamentals of Thermal Management. Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 5: Fundamentals of Design for Reliability. Chapter 6: Fundamentals of Thermal Management. Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.
Glossary.
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