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Electronic Assembly Fabrication

ISBN10: 0071378820 | ISBN13: 9780071378826

Electronic Assembly Fabrication
ISBN10: 0071378820
ISBN13: 9780071378826
By Charles Harper

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill. Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into: * Chips * Boards * Solders * Packages * Interconnections * Substrates * Deposition * Cleaning * Coating * The latest environmental rules and constraints ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.

Preface

Contributors

Dedication

Chapter 1: Printed Circuit History and Overview

Chapter 2: Development and Fabrication of IC Chips

Chapter 3: Packaging of IC Chips

Chapter 4: Laminates and Prepregs as Circuit Board Base Materials

Chapter 5: Printed Circuit Board Fabrication

Chapter 6: Package and Component Attachment and Interconnection

Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication

Chapter 8: Printed Wiring Board Cleaning

Chapter 9: Board Coating Materials and Processes

Chapter 10: Flexible and Rigid Flexible Fabrication

Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites

Chapter 12: Hybrid Microelectronics and Multichip Module Technologies

Chapter 13: Environmental Considerations in Electronic Assembly Fabrication

Index

About the Editor

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