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ISBN10: 0071443746 | ISBN13: 9780071443746
ISBN10: 0071443746
ISBN13: 9780071443746
Chapter 1: IntroductionChapter 2: Manufacturing Implementation ApproachesChapter 3: Selecting Lead-Free Alloys for Solder InterconnectionsChapter 4: Applying Solder PasteChapter 5: Selecting Component Coating and PCB Surface FinishChapter 6: Applying Mass Reflow SolderingChapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 3: Selecting Lead-Free Alloys for Solder InterconnectionsChapter 4: Applying Solder PasteChapter 5: Selecting Component Coating and PCB Surface FinishChapter 6: Applying Mass Reflow SolderingChapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 5: Selecting Component Coating and PCB Surface FinishChapter 6: Applying Mass Reflow SolderingChapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
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