Skip to main content

ISBN10: 0071455566 | ISBN13: 9780071455565

MEMS/MOEM Packaging, 1st Edition

ISBN10: 0071455566
ISBN13: 9780071455565
By Ken Gilleo

© 2006 Published July 11, 2005

ISBN10: 0071455566 | ISBN13: 9780071455565

More information about this Print book can be found in the page section below.

$197.00
ISBN10: 0071455566 | ISBN13: 9780071455565

More information about this Print book can be found in the page section below.

Step 1. Download Adobe Digital Editions to your PC or Mac desktop/laptop.

Step 2. Register and authorize your Adobe ID (optional). To access your eBook on multiple devices, first create an Adobe ID. Then, open Adobe Digital Editions, go to the Help menu, and select "Authorize Computer" to link your Adobe ID.

Step 3. Open Your eBook. Use Adobe Digital Editions to open the file. If the eBook doesn’t open, contact customer service for assistance.

PREFACE

Chapter 1: Engineering Fundamentals of MEMS and MOEMS Electronic Packaging

1.1: The Package as the Vital Bridge

1.2: Packaging Challenges

1.3: Multiple Functions

1.4: Package Types

1.5: Reliability and Qualification

1.6: Summary

Chapter 2: Principles, Materials, and Fabrication of MEMS and MOEMS Devices

2.1: Definitions and Classifications

2.2: Basic Principles

2.3: Sensing

2.4: MEMS Sensor Principles

2.5: Motion Actuation

2.6: MEMS "Engines"

2.7: CAD Structure Library; Building Blocks

2.8: MEMS Devices

2.9: Optical-MEMS; MOEMS

2.10: Intelligent MEMS

2.11: MEMS Applications

2.12: MOEMS Devices -- MEMS Plus Light

2.13: Summary

Chapter 3: MEMS and MOEMS Packaging Challenges and Strategies

3.1: Product-Specific Character of MEMS Packaging

3.2: MEMS General Packaging Requirements

3.3: Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual

3.4: Cost versus Performance Tradeoffs

3.5: Emergence of Low-Cost Near-Hermetic Packaging

3.6: Manufacturing Process Comparisons

3.7: The Packaging MOEMS (Optical-MEMS) -- Additional Requirements

3.8: Packages for Materials Handling

3.9: NHP Beyond MEMS

Chapter 4: MEMS Packaging Processes

4.1: Release Step

4.2: Singulation: Sawing and Protection

4.3: Capping Approaches

4.4: Die Attach

4.5: Wire Bonding

4.6: Flip Chip Methods

4.7: Tape Automated Bonding (TAB)

4.8: Selective Underfill and Encapsulation

4.9: Lid Sealing

4.10: Antistiction Processes

4.11: In-Process Handling

4.12: Applying In-Package Additives

4.13: Equipment

4.14: Testing

4.15: Reliability

4.16: Selecting the Right MEMS/MOEMS Package and Materials

4.17: Conclusions and Summary

Chapter 5: MEMS Packaging Materials

5.1: The Process Determines the Materials

5.2: Joining Materials

5.3: Assembly Issues and Material Solutions

5.4: In-Package Additives

5.5: Conclusions

Chapter 6: From MEMS and MOEMS to Nano Technology

6.1: Definitions are Important

6.2: Combining Nano and MEMS

6.3: Packaging Nano

6.4: Summary, Conclusions and the Future

Bibliography

Index

Need support?   We're here to help - Get real-world support and resources every step of the way.

Top