MEMS/MOEM Packaging, 1st Edition

PREFACE

Chapter 1: Engineering Fundamentals of MEMS and MOEMS Electronic Packaging

1.1: The Package as the Vital Bridge

1.2: Packaging Challenges

1.3: Multiple Functions

1.4: Package Types

1.5: Reliability and Qualification

1.6: Summary

Chapter 2: Principles, Materials, and Fabrication of MEMS and MOEMS Devices

2.1: Definitions and Classifications

2.2: Basic Principles

2.3: Sensing

2.4: MEMS Sensor Principles

2.5: Motion Actuation

2.6: MEMS "Engines"

2.7: CAD Structure Library; Building Blocks

2.8: MEMS Devices

2.9: Optical-MEMS; MOEMS

2.10: Intelligent MEMS

2.11: MEMS Applications

2.12: MOEMS Devices -- MEMS Plus Light

2.13: Summary

Chapter 3: MEMS and MOEMS Packaging Challenges and Strategies

3.1: Product-Specific Character of MEMS Packaging

3.2: MEMS General Packaging Requirements

3.3: Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual

3.4: Cost versus Performance Tradeoffs

3.5: Emergence of Low-Cost Near-Hermetic Packaging

3.6: Manufacturing Process Comparisons

3.7: The Packaging MOEMS (Optical-MEMS) -- Additional Requirements

3.8: Packages for Materials Handling

3.9: NHP Beyond MEMS

Chapter 4: MEMS Packaging Processes

4.1: Release Step

4.2: Singulation: Sawing and Protection

4.3: Capping Approaches

4.4: Die Attach

4.5: Wire Bonding

4.6: Flip Chip Methods

4.7: Tape Automated Bonding (TAB)

4.8: Selective Underfill and Encapsulation

4.9: Lid Sealing

4.10: Antistiction Processes

4.11: In-Process Handling

4.12: Applying In-Package Additives

4.13: Equipment

4.14: Testing

4.15: Reliability

4.16: Selecting the Right MEMS/MOEMS Package and Materials

4.17: Conclusions and Summary

Chapter 5: MEMS Packaging Materials

5.1: The Process Determines the Materials

5.2: Joining Materials

5.3: Assembly Issues and Material Solutions

5.4: In-Package Additives

5.5: Conclusions

Chapter 6: From MEMS and MOEMS to Nano Technology

6.1: Definitions are Important

6.2: Combining Nano and MEMS

6.3: Packaging Nano

6.4: Summary, Conclusions and the Future

Bibliography

Index