Skip to main content

Humanities, Social Science and Language


Digital Products


Connect®
Course management and student learning tools backed by great support.

McGraw Hill GO
Greenlight learning with the new eBook+

ALEKS®
Personalize learning and assessment

ALEKS® Placement, Preparation, and Learning
Achieve accurate math placement

SIMnet
Ignite mastery of MS Office and IT skills

McGraw Hill eBook & ReadAnywhere App
Get learning that fits anytime, anywhere

Sharpen: Study App
A reliable study app for students

Virtual Labs
Flexible, realistic science simulations

AI Reader
Encourage Discovery, Boost Understanding

Services


Affordable Access
Reduce costs and increase success

Learning Management System Integration
Log in and sync up

Content Collections powered by Create®
Curate and deliver your ideal content

Custom Courseware Solutions
Teach your course your way

Education for All
Let’s build a future where every student has a chance to succeed

Business Program
Explore business learning solutions & resources

Professional Services
Collaborate to optimize outcomes

Remote Proctoring
Validate online exams even offsite

Institutional Solutions
Increase engagement, lower costs, and improve access for your students

Evergreen
Updated, relevant materials—without the hassle.

Support


General Help & Support Info
Customer Service & Tech Support contact information

Online Technical Support Center
FAQs, articles, chat, email or phone support

Support At Every Step
Instructor tools, training and resources for ALEKS, Connect & SIMnet

Instructor Sample Requests
Get step by step instructions for requesting an evaluation, exam, or desk copy

Platform System Check
System status in real time

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

ISBN10: 1259861554 | ISBN13: 9781259861550

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
ISBN10: 1259861554
ISBN13: 9781259861550
By Rao Tummala

Step 1 . Download Adobe Digital Editions to your PC or Mac desktop/laptop.

Step 2. Register and authorize your Adobe ID (optional). To access your eBook on multiple devices, first create an Adobe ID at account.adobe.com. Then, open Adobe Digital Editions, go to the Help menu, and select "Authorize Computer" to link your Adobe ID.

Step 3. Open Your eBook. Use Adobe Digital Editions to open the file. If the eBook doesn’t open, contact customer service for assistance.

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practices This thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore’s Law for packaging, as Moore’s Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore’s Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore’s Law for ICs. This book lays the groundwork for Moore’s Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with <16 I/Os in the 1960s with leadframe-plastic packages to the current silicon interposers with about 200,000 I/Os. It proposes a variety of ways to extend Moore’s Law, such as extending Si interposers and beyond using glass panel embedding. As Moore’s Law for Electronic Packaging comes to its end, this book proposes 3D opto-electronics in the short term and, ultimately, Quantum Computing as the next Moore’s Law.

Need support?   We're here to help - Get real-world support and resources every step of the way.

Top