Area Array Packaging Handbook: Manufacturing and Assembly, 1st Edition

Forword

Section 1: Packaging Concepts and Design

Chapter 1: Introduction to Electronic Packaging

Chapter 2: Electronics Industry Overview

Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry

Chapter 4: Area Array Packaging

Chapter 5: Stacked/3D Packages

Chapter 6: Compliant IC Packaging

Chapter 7: Flip Chip Technology

Chapter 8: Options in High-Density Part Cleaning

Chapter 9: MEMS Packaging and Assembly Challenges

Chapter 10: Ceramic Ball and Column Grid Array Overview

Section 2: Materials

Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills

Chapter 12: Hermetic Packaging Systems: Adhesive and Getter

Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes

Chapter 14: Modern Solder and Solder Paste

Chapter 15: Lead-Free Systems and Process Implications

Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?

Section 3: Equipment and Processes

Chapter 17: Next-Generation Flip Chip Materials and Processes

Chapter 18: Flip Chip Assembly and Underfilling

Chapter 19: BGA and CSP Rework: What is Involved?

Chapter 20: BGA Assembly Reliability

Chapter 21: Die Attach and Rework

Chapter 22: Liquid Encapsulation Equipment and Processes

Chapter 23: Molding for Area Array Packages

Chapter 24: Screen Printing and Stenciling

Chapter 25: Criteria for Placement and Processing of Advanced Packages

Chapter 26: Ovens in Electronics

Chapter 27: Process Development, Control, and Organization

Section 4: Economics and Productivity

Chapter 28: Metrics: The Key to Productivity

Chapter 29: Cost Estimating for Electronic Assembly

Section 5: Future

Chapter 30: The Future of Electronic Packaging

Chapter 31: The Future of SMT Process Equipment

Index