System on Package 1 9780071459068
System on Package

System on Package

1st Edition
By Rao Tummala
ISBN10: 0071459065
ISBN13: 9780071459068
Copyright: 2008

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ISBN10: 0071459065 | ISBN13: 9780071459068



The estimated amount of time this product will be on the market is based on a number of factors, including faculty input to instructional design and the prior revision cycle and updates to academic research-which typically results in a revision cycle ranging from every two to four years for this product. Pricing subject to change at any time.

Program Details

Chapter 1. Introduction to the System-on-Package (SOP) Technology
Chapter 2. Introduction to System-on-Chip (SOC)
Chapter 3. Stacked ICs and Packages (SIP)
Chapter 4. Mixed-Signal (SOP) Design
Chapter 5. Radio Frequency System-on-Package (RF SOP)
Chapter 6. Integrated Chip-to-Chip Optoelectronic SOP
Chapter 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components
Chapter 8. Mixed-Signal Reliability
Chapter 9. MEMS Packaging
Chapter 10. Wafer-Level SOP
Chapter 11. Thermal SOP
Chapter 12. Electrical Test of SOP Modules and Systems
Chapter 13. Biosensor SOP

About the Author

Rao Tummala

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.