Handbook of Plastics Technologies https://www.mheducation.com/cover-images/Jpeg_400-high/0071460683.jpeg 2 9780071460682
Handbook of Plastics Technologies

Handbook of Plastics Technologies

2nd Edition
By Charles Harper
ISBN10: 0071460683
ISBN13: 9780071460682
Copyright: 2006

Purchase Options

Students, we’re committed to providing you with high-value course solutions backed by great service and a team that cares about your success. See tabs below to explore options and pricing. Don't forget, we accept financial aid and scholarship funds in the form of credit or debit cards.


Out of stock

ISBN10: 0071460683 | ISBN13: 9780071460682



The estimated amount of time this product will be on the market is based on a number of factors, including faculty input to instructional design and the prior revision cycle and updates to academic research-which typically results in a revision cycle ranging from every two to four years for this product. Pricing subject to change at any time.

Program Details

Chapter 1: Fundamentals of Polymers and Plastics (Carol M.F. Barry, Anne-Marie Baker, Joey L. Mead)

Chapter 2: Thermoplastics (Anne-Marie Baker, Joey L. Mead)

Chapter 3: Thermosets (Rudolph D. Deanin)

Chapter 4: Elastomers (Aubert Y. Coran)

Chapter 5: Plastic Additives (Rudolph D. Deanin)

Chapter 6: Nanomanufacturing with Polymers (Daniel Schmidt, Joey L. Mead, Carol M.F. Barry)

Chapter 7: Plastics Joining (Edward M. Petrie)

Chapter 8: Plastics Recycling and Biodegradable Plastics (Susan E. Selke)

Chapter 9: Plastics and Elastomers: Automotive Applications (K. Sehanobish and Tom Traugott)

About the Author

Charles Harper

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.